Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger

ABSTRACT

A semiconductor device assembly includes: a semiconductor device; a heat exchanger; and a thermal interface material. In embodiments, the thermal interface material may contact a facing surface of the heat exchanger, the thermal interface material includes alloys that react with a bond enhancing agent to form an indium alloy layer in a portion of the thermal interface. In embodiments, a solid, solder preformed thermal interface material includes an indium metal and may be disposed on the first surface of the semiconductor device; and a liquid metal bond enhancing agent may be disposed on a first surface of the semiconductor device; and contacting a facing surface of the heat exchanger.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/833,982, filed Dec. 6, 2017, titled “APPARATUS AND METHODS FORCREATING A THERMAL INTERFACE BOND BETWEEN A SEMICONDUCTOR DIE AND APASSIVE HEAT EXCHANGER”, and issued as U.S. Pat. No. 10,607,857 on Mar.31, 2020. The content of which is incorporated herein by reference inits entirety.

TECHNICAL FIELD

The disclosed technology relates generally to assembly systems andmethods for circuits. More particularly, some embodiments relate toapparatus and methods for joining a semiconductor die to a passive heatexchanger.

DESCRIPTION OF THE RELATED ART

The dissipation of heat is a key to maintaining longevity andreliability of semiconductor and power devices. As semiconductor devicesdecrease in size and increase in performance, heat exchangers or heatsinks (sometimes also referred to as heat spreaders or lids) have becomemore common in various applications to provide a mechanism for heatdissipation. Thermal interface materials are commonly used between theheat-producing semiconductor device and its associated heatsink. Thermalinterface materials can be used to provide a more efficient and reliableconduction of heat from the device to the heatsink. Common thermalinterface materials are metal-based, which means they have a very highconductivity as compared to polymer-based thermal interface materials.

Indium metal is often used as a thermal interface material due to acombination of properties: 1) relatively high thermal conductivitycompared to competing thermal interface materials, 2) a lowflow-stress/high degree of malleability, 3) acceptable mechanicalstrength for this type of application without an external mechanicalfixturing mechanism, and 4) it is a solid material that will not moveoutside the bond area or develop air pockets during normal use. Indium'sductility and thermal conductivity make it ideal as a compressiblethermal interface material.

A traditional thermal interface that uses indium metal requires thesemiconductor die to have a backside metallization. This metallizationis typically made up of three parts: 1) a reactive layer, 2) a barrierlayer, and 3) a passivation layer. A common metallization for thebackside of an integrated circuit may be, for example, titanium, nickel,and gold (from die surface, respectively), although many other materialscan be used to provide the same or similar functions.

Indium will bond to non-metallic surfaces such as the silicon dioxidesurface of a semiconductor die. It's bond strength to non-metals is highenough to provide desired mechanical attachment, but elevated processtemperatures and the required scrubbing of the indium material on thedie are not currently feasible with these components.

FIG. 1 is a diagram illustrating an example process for semiconductordie processing. Referring now to FIG. 1, in this example at operation122 the die is attached to the substrate such as by attachment throughI/Os on the active service of the die. For example, the die can beattached to the substrate in a flip-chip attachment process. Then, atoperation 124 the assembly is re-flowed to bond the die to the packagesubstrate. The assembly can then be cleaned and at operation 126 underfilled such as by under filling with a specialized polymer. At operation128, solder spheres are disposed on the side of the substrate oppositethe semiconductor die so that the substrate can be joined to the circuitboard. Accordingly, at operation 130 the package is reflowed, this timeto bond the spheres to the substrate. The assembly can then be cleanedand is ready for use.

FIG. 2 illustrates an example of an assembly mounted onto a circuitboard. In this example, semiconductor device 158 is mounted to circuitboard 160. Particularly, solder spheres 174 were placed on metallizedpads 172 of the semiconductor device 158 and reflowed to electricallyconnect metallized pads 172 two the electrical connectors 176 of theprinted circuit board. 178 illustrates the underfill applied between thesemiconductor device 158 and circuit board 160. This example furthershows that backside metallization 156 is applied to semiconductor device158 so that thermal interface 154 can be bonded to semiconductor device158. Heat exchanger 152 is joined to semiconductor device 158 withthermal interface 154.

BRIEF SUMMARY OF EMBODIMENTS

Disclosed is a novel method of joining a semiconductor die to a passiveheat exchanger. This method uses the ability of indium to bond to anon-metallic surface to form the thermal interface. Bonding is enhancedby a secondary coating on either (or both) joining surfaces. Joiningsurfaces in this case are typically an integrated circuit (IC) and apassive heat exchanger, commonly referred to as an integrated heat sink,a heat spreader, or a lid.

In one embodiment, a method for bonding a semiconductor device to a heatexchanger may include: providing a semiconductor device; applying a bondenhancing agent to a first surface of the semiconductor device; creatingan assembly and reflowing the assembly such that the thermal interfacebonds the heat exchanger to the semiconductor device. The assembly mayinclude in various embodiments a thermal interface having a first majorsurface and a second major surface opposite the first major surface,wherein the thermal interface is disposed on the semiconductor devicesuch that the first major surface of the thermal interface material isin touching relation with the bond enhancing agent on the semiconductordevice; and a heat exchanger disposed in touching relation with thesecond major surface of the thermal interface material. In variousembodiments the thermal interface can include an indium metal, and thebond enhancing agent can include at least one of a an organotitanate,and an organozirconate.

The bond enhancing agent can include an oxide seed layer deposited byapplying a bulk liquid metal to the semiconductor device and removingthe bulk liquid metal to leave the oxide seed layer. The oxide seedlayer may be alloyed with the thermal interface to form a solid alloy.

The semiconductor device may be bonded to the heat exchanger withoutusing a separate metallization layer to bond the thermal interface tothe semiconductor device. The method may also include applying a bondenhancing agent to a surface of the heat exchanger that is to bedisposed in touching relation with the second major surface of thethermal interface material.

In other embodiments, a semiconductor device assembly may include: asemiconductor device; a bond enhancing agent disposed on a first surfaceof the semiconductor device; a thermal interface disposed on the firstsurface of the semiconductor device that may include a first majorsurface and a second major surface opposite the first major surface;wherein the thermal interface is disposed on the semiconductor devicesuch that the first major surface of the thermal interface material isin touching relation with the bond enhancing agent on the semiconductordevice; and a heat exchanger disposed on the thermal interface intouching relation with the second major surface of the thermalinterface.

The thermal interface can include an indium metal, and in someembodiments the bond enhancing agent can include at least one of anorganotitanate, and an organozirconate. In other embodiments, the bondenhancing agent can include an oxide seed layer deposited, for example,by applying a bulk liquid metal to the semiconductor device and removingthe bulk liquid metal to leave the oxide seed layer. Liquid alloys thatcan be used to create an oxide seed layer can include, for example,alloys comprising indium, gallium, or a combination of indium andgallium; the foregoing with the addition of tin in some cases. Examplesof alloys can include the Indalloy® alloys available from the IndiumCorporation. The oxide seed layer may be alloyed with the thermalinterface to form a solid alloy.

The semiconductor device may be bonded to the heat exchanger withoutusing a separate metallization layer to bond the thermal interface tothe semiconductor device. The heat exchanger can include a heat sink, aheat spreader, or a lid

Other features and aspects of the disclosed technology will becomeapparent from the following detailed description, taken in conjunctionwith the accompanying drawings, which illustrate, by way of example, thefeatures in accordance with embodiments of the disclosed technology. Thesummary is not intended to limit the scope of any inventions describedherein, which are defined solely by the claims attached hereto.

BRIEF DESCRIPTION OF THE DRAWINGS

The technology disclosed herein, in accordance with one or more variousembodiments, is described in detail with reference to the followingfigures. The drawings are provided for purposes of illustration only andmerely depict typical or example embodiments of the disclosedtechnology. These drawings are provided to facilitate the reader'sunderstanding of the disclosed technology and shall not be consideredlimiting of the breadth, scope, or applicability thereof. It should benoted that for clarity and ease of illustration these drawings are notnecessarily made to scale.

FIG. 1 is a diagram illustrating an example process for semiconductordie processing.

FIG. 2 illustrates an example of an assembly mounted onto a circuitboard.

FIG. 3 is a diagram illustrating an example configuration using a bondenhancing agent in accordance with one embodiment of the technologydescribed herein.

FIG. 4 is a diagram illustrating an example process for applying athermal interface in accordance with one embodiment of the technologydescribed herein.

FIG. 5 is a diagram illustrating an example of an assembly assembledinto its final configuration with a bond enhancing agent disposed on asemiconductor device between the thermal interface material and thesemiconductor device in accordance with one embodiment of the technologydescribed herein.

FIG. 6. Illustrates an example in which an oxide seed layer is depositedon semiconductor device in accordance with one embodiment of thetechnology described herein.

FIG. 7 illustrates the formation of an indium alloy from the oxide seedlayer as a result of a reflow operation in accordance with oneembodiment of the technology described herein.

FIG. 8 illustrates an example in which the thermal interface material isapplied separately to both joining surfaces in accordance with oneembodiment of the technology described herein.

FIG. 9 illustrates an example in which a bond enhancing agent is appliedto both the semiconductor device and heat exchanger prior to assembly.

The figures are not intended to be exhaustive or to limit the inventionto the precise form disclosed. It should be understood that theinvention can be practiced with modification and alteration, and thatthe disclosed technology be limited only by the claims and theequivalents thereof.

DETAILED DESCRIPTION OF THE EMBODIMENTS

According to various embodiments of the disclosed technology, indium canbe bonded to a non-metallic surface of a semiconductor device to form athermal interface. In some embodiments, this bonding can be enhanced byapplying a secondary coating on either or both joining surfaces of thesemiconductor die (e.g., an integrated circuit or other semiconductordevice) and its respective heat exchanger.

In some embodiments, a bond enhancing agent is used to promote thewetting or cold welding of the indium thermal interface to thesemiconductor device. The bond enhancing agent can include, for example,a liquid metal that is capable of wetting to the bare semiconductordevice and provides a seed layer for the indium. The bulk liquid metalcan be removed, leaving an oxide seed layer which, when alloyed withindium through the reflow, would result in a remaining alloy that is asolid similar to pure indium. As another example, an organotitanate ororganozirconate, or other like materials, could be sprayed or otherwisedeposited onto the bare die surface, which would promote the bonding ofindium to the bare die. In another example, a silver-filled polymeradhesive could be sprayed or otherwise deposited onto the bare diesurface.

FIG. 3 is a diagram illustrating an example configuration using a bondenhancing agent in accordance with one embodiment of the technologydescribed herein. FIG. 4 is a diagram illustrating an example processfor applying a thermal interface in accordance with one embodiment ofthe technology described herein. With reference now to FIGS. 3 and 4, inthis example, at operation 412 a bond enhancing agent 380 is applied tothe semiconductor die 358. In this example, bond enhancing agent 380 isapplied directly to the surface of semiconductor die 358 to which thethermal interface 354 is to be mounted. As noted above, bond enhancingagent 380 can be used to promote the wetting or cold welding of thethermal interface 354 (e.g., and indium metal thermal interface) to thesurface of semiconductor device 358. At operation 414, the assembly canbe assembled into its final configuration, an example of which is shownin FIG. 5, and at operation 416, the assembly can be reflowed to meltthe thermal interface and secure heat exchanger 352 to semiconductordevice 358.

As noted above, in some embodiments, the bond enhancing agent (e.g.,agent 380) can be a bulk liquid metal that is applied and removed toleave an oxide seed layer which is alloyed with indium through reflow.FIG. 6. Illustrates an example of this in which an oxide seed layer 385is deposited on semiconductor device 358 using this process. FIG. 7illustrates the formation of an indium alloy 390 as a result of thereflow operation. Liquid metals that can be used to create an oxide seedlayer can include, for example, alloys comprising indium, gallium, or acombination of indium and gallium; the foregoing with the addition oftin in some cases. Examples of alloys can include the Indalloy® alloysavailable from the Indium Corporation.

Due to the ability of indium to cold weld, indium can be applied on bothjoining surfaces either separately or at the same time. An example ofthis is shown at FIG. 8, in which the thermal interface is appliedseparately to both surfaces. In particular, in this example, thermalinterface 354 is applied both to heat exchanger 352 and twosemiconductor device 358. If the thermal interface is appliedseparately, the parts can be assembled in a separate step, and may ormay not be reflowed to create a homogeneous joint from the two separateindium layers.

It is noted that in further embodiments, the bond enhancing agent (e.g.bond enhancing agent 380) may be applied to both the semiconductordevice 358 and heat exchanger 352 to facilitate bonding of the thermalinterface 354 to both components. FIG. 9 illustrates an example of thisin which a bond enhancing agent 380 is applied to both the semiconductordevice 358 and heat exchanger 352 prior to assembly.

As the foregoing examples illustrate, embodiments can be provided thatenhance the ability of indium to bond to non-metals (such as, e.g., asemiconductor surface) at traditional reflow temperatures. Depending onthe application, these temperatures can be within a range ofapproximately 190° C. 210° C. In some applications, these temperaturesare approximately 200° C. Accordingly, embodiments may be implementedthat can yield benefits over conventional processes. These benefits mayinclude, for example, the elimination of resources used for backsidedie/wafer metallization, flux application or the curing process.

While various embodiments of the disclosed technology have beendescribed above, it should be understood that they have been presentedby way of example only, and not of limitation. Likewise, the variousdiagrams may depict an example architectural or other configuration forthe disclosed technology, which is done to aid in understanding thefeatures and functionality that can be included in the disclosedtechnology. The disclosed technology is not restricted to theillustrated example architectures or configurations, but the desiredfeatures can be implemented using a variety of alternative architecturesand configurations. Indeed, it will be apparent to one of skill in theart how alternative functional, logical or physical partitioning andconfigurations can be implemented to implement the desired features ofthe technology disclosed herein. Also, a multitude of differentconstituent module names other than those depicted herein can be appliedto the various partitions. Additionally, with regard to flow diagrams,operational descriptions and method claims, the order in which the stepsare presented herein shall not mandate that various embodiments beimplemented to perform the recited functionality in the same orderunless the context dictates otherwise.

Although the disclosed technology is described above in terms of variousexemplary embodiments and implementations, it should be understood thatthe various features, aspects and functionality described in one or moreof the individual embodiments are not limited in their applicability tothe particular embodiment with which they are described, but instead canbe applied, alone or in various combinations, to one or more of theother embodiments of the disclosed technology, whether or not suchembodiments are described and whether or not such features are presentedas being a part of a described embodiment. Thus, the breadth and scopeof the technology disclosed herein should not be limited by any of theabove-described exemplary embodiments.

Terms and phrases used in this document, and variations thereof, unlessotherwise expressly stated, should be construed as open ended as opposedto limiting. As examples of the foregoing: the term “including” shouldbe read as meaning “including, without limitation” or the like; the term“example” is used to provide exemplary instances of the item indiscussion, not an exhaustive or limiting list thereof; the terms “a” or“an” should be read as meaning “at least one,” “one or more” or thelike; and adjectives such as “conventional,” “traditional,” “normal,”“standard,” “known” and terms of similar meaning should not be construedas limiting the item described to a given time period or to an itemavailable as of a given time, but instead should be read to encompassconventional, traditional, normal, or standard technologies that may beavailable or known now or at any time in the future. Likewise, wherethis document refers to technologies that would be apparent or known toone of ordinary skill in the art, such technologies encompass thoseapparent or known to the skilled artisan now or at any time in thefuture.

The presence of broadening words and phrases such as “one or more,” “atleast,” “but not limited to” or other like phrases in some instancesshall not be read to mean that the narrower case is intended or requiredin instances where such broadening phrases may be absent. The use of theterm “module” does not imply that the components or functionalitydescribed or claimed as part of the module are all configured in acommon package. Indeed, any or all of the various components of amodule, whether control logic or other components, can be combined in asingle package or separately maintained and can further be distributedin multiple groupings or packages or across multiple locations.

Additionally, the various embodiments set forth herein are described interms of exemplary block diagrams, flow charts and other illustrations.As will become apparent to one of ordinary skill in the art afterreading this document, the illustrated embodiments and their variousalternatives can be implemented without confinement to the illustratedexamples. For example, block diagrams and their accompanying descriptionshould not be construed as mandating a particular architecture orconfiguration.

What is claimed is:
 1. A semiconductor device assembly, comprising: asemiconductor device; a heat exchanger; a solid, solder preformedthermal interface material disposed on a first surface of thesemiconductor device and contacting a facing surface of the heatexchanger, wherein the preformed thermal interface material comprises anindium metal; and an oxide seed layer on the first surface of thesemiconductor device formed by depositing a liquid metal bond enhancingagent on, and removing liquid metal bond enhancing agent from, the firstsurface of the semiconductor device prior to placing the solid, solderpreformed thermal interface material on the first surface of thesemiconductor device.
 2. The semiconductor device assembly of claim 1,wherein the semiconductor device is bonded to the heat exchanger by thesolid, solder preformed thermal interface material without using aseparate metallization layer to bond the thermal interface material tothe semiconductor device.
 3. The semiconductor device assembly of claim1, wherein the oxide seed layer may be alloyed with the thermalinterface to form a solid alloy.
 4. The semiconductor device assembly ofclaim 1, wherein the liquid metal bond enhancing agent comprises indiumor gallium or a combination of indium and gallium.
 5. The semiconductordevice assembly of claim 4, wherein the liquid metal bond enhancingagent further comprises tin.
 6. The semiconductor device assembly ofclaim 1, wherein the liquid metal bond enhancing agent comprisesIndalloy.
 7. The semiconductor device assembly of claim 1, wherein theoxide seed layer is alloyed with the thermal interface to form a solidalloy.
 8. The semiconductor device assembly of claim 1, wherein the heatexchanger comprises a heat sink, a heat spreader, or a lid.
 9. Thesemiconductor device assembly of claim 1, further comprising a bondenhancing agent disposed on the facing surface of the heat exchanger.10. The semiconductor device assembly of claim 1, wherein the liquidmetal bond enhancing agent comprises a surface reactive agent.
 11. Asemiconductor device assembly, comprising: a semiconductor device; aheat exchanger; and a thermal interface material comprising indium, thethermal interface material contacting a facing surface of the heatexchanger, wherein the thermal interface material comprises alloys thatreact with a bond enhancing agent to form an indium alloy layer in aportion of the thermal interface.
 12. The semiconductor device assemblyof claim 11, wherein the semiconductor device is bonded to the heatexchanger without using a separate metallization layer to bond thethermal interface material to the semiconductor device.
 13. Thesemiconductor device assembly of claim 11, wherein the heat exchangercomprises a heat sink, a heat spreader, or a lid.
 14. The semiconductordevice assembly of claim 11, further comprising a bond enhancing agentdisposed on the facing surface of the heat exchanger.
 15. Thesemiconductor device assembly of claim 11, wherein the semiconductordevice is bonded to the heat exchanger without using a separatemetallization layer to bond the thermal interface material to the heatexchanger.
 16. The semiconductor device assembly of claim 11, whereinthe bond enhancing agent comprises a surface reactive agent.